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Fan-Out SiP

Apr 28, 2023 in FOSiP

A Study on Alternative Substrate for FCBGA

Feb 8, 2023 in FCBGA

Design of Dual-Band (28/39GHz) Antenna-in-Package with broad bandwidth for 5G Millimeter-Wave Application

Jan 18, 2023 in 5G

Dk/Df Extraction and Moisture Effect on mmWave Fan-out Package Design

Dec 8, 2022 in Fan-Out Packaging

Broadband Dual-Polarized Antenna Array using AiP Techniques for 5G mmWave Beamforming Systems

Dec 8, 2022 in 5G

Board-Level Drop Impact Reliability Analysis of Dual-Side Molding System-in-Package (SiP) Modules

Nov 28, 2022 in SiP

Investigation of Low-Pressure Sn-Passivated Cu-to-Cu Direct Bonding in 3D-Integration

Nov 4, 2022 in 3D IC

Panel Level IC-Package Technology Development

Jul 29, 2022 in Panel Level Fan-out

Integration of Foundry MIM Capacitor and OSAT Fan-Out RDL for High Performance RF Filters

Jul 12, 2022 in 5G

Die Bonding Solution for Flip Chip-Chip Scale Package-DIC (Digital Image Correlation) and Shadow Moiré Application

Jul 12, 2022 in FCCSP

3D Composite Polymer Package for Digital Health Wearable Devices

Jul 12, 2022 in SiP

Electrical Performance Analysis for Bridge Die Package Solution

Jun 17, 2022 in FOCoS-Bridge

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